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EngadgetJan 06, 2026
The Morning After: Sony Honda's new car, Lego's first CES press event and more
Welcome to your first CES edition of TMA, attempting (almost futilely) to distill the biggest product reveals and announcements. Despite two days of briefings and conferences, today is merely day one. However, we've already seen Sony Honda reveal its next car — and the Afeela 1 isn't yet on sale. We've got a deep dive on what we've seen so far, right here.

AMD announced new Ryzen AI 400 laptop processors and updated desktop chips, including the Ryzen 7 9850X3D, with a new focus broadly on AI processing improvements. NVIDIA had a lengthy, dense press conference showing off its dominance in AI tech, but it lacked major consumer announcements — until overnight, when it revealed next-gen G-Sync tech and an upgraded version of DLSS. The new tech can handle up to 4K 240Hz path traced performance. It also adds an improved version of Super Resolution Transformer, with more stability.

This year's wildcard CES press conference was… Lego? It revealed Smart Bricks, which adds sensors, audio and wireless communication to traditional Lego pieces. The system is launching with Star Wars sets later this year — and perhaps crucially, no smartphone or screen is needed to play.

There's also LG and Samsung to get into — more on those below!

— Mat Smith

The other big stories (an


EngadgetJan 05, 2026
AMD's new Ryzen AI Max chips and Ryzen 7 9850X3D court desktop enthusiasts at CES 2026
While it's nice to see desktop support in AMD's new Ryzen AI 400 chips, demanding gamers and enthusiasts will likely be more intrigued by the company's next batch of Ryzen AI Max chips, as well as the new Ryzen 7 9850X3D with 3D V-Cache. The former will make its way into small desktops and a handful of workhorse laptops, while the latter is another option for gamers who want the speed bump of 3D V-cache without shelling out for the $700 9950X3D. 

Last year, AMD debuted its Ryzen AI Max chips as a way to create a single piece of silicon with powerful CPU cores, GPU cores, NPUs and integrated memory, similar to Apple's home-brewed chips. At the time, AMD VP Joe Macri also noted that the existence of Apple Silicon helped make the Ryzen AI Max chips possible.

"Many people in the PC industry said, well, if you want graphics, it's gotta be discrete graphics because otherwise people will think it's bad graphics," Macri said at last year's CES. "What Apple showed was consumers don't care what's inside the box. They actually care what the what the box looks like. They care about the screen, the keyboard, the mouse. They care about what it does."



EngadgetJan 05, 2026
Samsung Galaxy Z TriFold hands-on: Flexing is believing at CES 2026


When I first heard whispers about the Samsung Galaxy Z TriFold, I immediately felt conflicted. On one hand it felt like the natural evolution of bi-fold phones like the Z Fold 7. But on the other, all this fancy tech comes with an even higher price — around $2,500 based on current conversion rates from Korean won — not to mention the added bulk you get from a third folding panel. So even as someone who has used a foldable as my daily driver for almost a decade straight, it felt like Samsung's latest high-end phone was going backwards in terms of both portability and affordability. But then at CES 2026, I got a chance to go hands-on with the Galaxy Z TriFold and all of my concerns pretty much instantly disappeared because with this thing, flexing is believing.

My initial consternation comes in large part from using the Z Fold 7, which hit a major milestone this year thanks to a revamped design that doesn't come with any added size or weight even when compared to comparable candybar-style phones like the Galaxy S25 Ultra. That's a major breakthrough considering how hefty and chunky the

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